Home
Catalog

Download sample

File Details

Published: 2024-02-18 12:14:07.585956 Category: Industry Type: Photo Model release: No

Share

Computer chip manufacturing at fab. Semiconductor packaging process. Close-up of silicon die are being extracted from semiconductor wafer and attached to substrate by pick and place machine.

Contributor: Евгений Федоров

ID : 739219703

FilesPrints and Products

Title	Filesize
Photo	3584x5376

Buy on Adobe Stock

Keywords

manufacturing, science, technology, equipment, machine, process, research, chips, industrial, semiconductor, silicon, computer, industry, wafer, arm, circuit, development, die, electronic, facility, factory, integrated, memory, production, component, device, disc, processor, controller, fabrication, foundry, microchip, nanotechnology, shortage, transistor, line, lithography, photolithography, package, cardboard box, advanced, robotic, constructed, substrate, central processing unit, cardboard box, central processing unit