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Published: 2024-05-12 12:37:16.152732 Category: Hobbies and Leisure Type: Illustration Model release: No
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Semiconductor Wafer after Dicing Process. Silicon Dies are Being Extracted by Pick and Place Machine. Computer Chip Manufacturing, Packaging Process

Contributor: Ahmed
ID : 812645366
TitleFilesize
Illustration8064x5376


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Keywords
microelectronics, integrated circuit, technology, industrial, assembly line, production, factory


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