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Published: 2023-02-27 14:44:22.492139 Category: Technology Type: Photo Model release: Yes
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Silicon Dies are being Attached to Substrate by Pick and Place Machine on Semiconductor Factory. Computer Chip Manufacturing at Fab. Packaging Process.

Contributor: IM Imagery
ID : 575964549
TitleFilesize
Photo6400x3600


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Keywords
computer, chips, wafer, processor, central processing unit, silicon, electronic, semiconductor, circuit, microchip, integrated, controller, arm, transistor, disc, cardboard box, package, substrate, factory, foundry, manufacturing, production, facility, equipment, nanotechnology, photolithography, lithography, jampacked, industry, industrial, machine, fabrication, constructed, device, process, shortage, memory, line, development, component, technology, science, research, die


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